Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing. Teledyne DALSA exists for the long term. Our goal is to build upon our 30 year heritage of developing the world's leading high performance digital imaging and semiconductor solutions and to accelerate our level of innovation. We focus on R&D development but also draw on the capabilities available to us as part of a larger organization. We seek to deliver products and technology that are truly innovative so that we can help our customers succeed.
CCD vs CMOS – Which is Better?
Line Scan Imaging: Emerging Developments, Uses and Future
Lithium Ion Battery Inspection: Looking Towards the Future
3D Laser Triangulation: Revolutionizing the Vision Technology Industry
Infrared Imaging: A Recent Overview of the Field
The Possibilities of Quality Control Imaging with the Teledyne Linea Lite
High Speed Imaging: Applications and Possibilities
The Increasing Usage of AI in the Manufacturing Industry: Challenges and Further Evolution
SWIR Cameras for Agricultural Sorting and Inspection
Teledyne Introduces Shutterless Version of Its Compact Thermal Camera Core
Teledyne DALSA Extends Its Falcon Area Scan Camera Series with New 37M and 67M Models
Teledyne Introduces Contact Image Sensors for High-speed, High-resolution Line Scan Imaging
A Donut Inspection
Teledyne AxCIS Contact Image Sensor