Sensors General News

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Call for Thermographers to Contribute to InfraR+D Conference

The Infrared Training Centre (ITC) in conjunction with FLIR Systems has announced a unique possibility for thermographers from around the world to submit a contribution for their next InfraR&D conference.

11 Jul 2011

Researchers Develop Zinc Detecting Sensor

Scientists from Queen Mary’s School of Biological and Chemical Sciences have developed a sensor that can detect Zinc.

6 Jul 2011

BESTECH Launches Micro-Epsilon LLT 2710 Laser Profile Scanner for 2D and 3D Products

BESTECH Australia has introduced a new laser profile scanner, which not only measures but also evaluates complex 2D and 3D products. For 2D profile measurement on different target surfaces, the Micro-Epsilon LLT 2710 laser profile sensor makes use of laser triangulation.

28 Jun 2011

Microchip Releases Low-Power mTouch Capacitive Sensing Module

Microchip Technology declared that it has added a new on-chip, 12-bit ADC, intelligent mTouch capacitive sensing module to its range of 16-bit eXtreme Low Power PIC MCUs.

From Microchip Technology Inc. 28 Apr 2011

Powercast Introduces Lifetime Power Wireless Sensor System

Powercast, a company specializing in RF-based wireless power and energy solutions, declared that it has launched Lifetime Power Wireless Sensor System that can be used to observe environmental conditions in HVAS building and control automation.

From Powercast Corporation 25 Apr 2011

Viscom, CyberOptics Launch 3D Solder Paste Inspection Sensor Technology

CyberOptics and Viscom have joined hands to come up with leading edge technology for 3D SPI sensors.

21 Mar 2011

IDENT Enhances Mobile Proximity Sensing with ULPP Technology

IDENT Technology, a developer of three-dimensional gesture control solutions and innovative proximity sensing signed three license contracts with IC manufacturers for its patented Ultra Low Power Proximity (ULPP) technology. A mouse product was launched by a global OEM license partner in January using the same technology.

14 Feb 2011

Primary PowerDI5060 Package System from Diodes

Diodes, global fabricator and provider of standard application specific solutions, has launched its primary PowerDI5060 package device called, the DMP3010LPS, that is 30V rated with p-channel enhancement mode MOSFET that offers designers of netbooks, notebooks, and other consumer electronics improvement in reliability and lowers the PCB space necessities.

From Diodes Incorporated 21 Dec 2010

YSU to Device High-Tech Sensor System

Youngstown State University will be awarded $1.6 million or more in state funds for generating sensing devices for advanced manufacturing purposes.

8 Sep 2010

Potomac Photonics Develops Ultra-Miniature Sensor Nodes

Potomac Photonics, a leading company specialized in the micro-designing of miniature products, declared their accomplishment of Phase 1 NSF SBIR agreement for the wireless sensor connection miniaturization

30 Aug 2010

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