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New Highly Sensitive Sensor with Gold Nanoparticle Array

New Highly Sensitive Sensor with Gold Nanoparticle Array

Cree and STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement

Cree and STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement

AAEON Partners with Gorilla Tech to Showcase High-Performance A.I. Computing at CES 2019

AAEON Partners with Gorilla Tech to Showcase High-Performance A.I. Computing at CES 2019

Robust, Highly Flexible Ultrasonic Sensors

Robust, Highly Flexible Ultrasonic Sensors

Ultra-Precision Gaging Probes Offer Highly Accurate Dimension Measurement for QC, Metrology and Inspection Applications

Ultra-Precision Gaging Probes Offer Highly Accurate Dimension Measurement for QC, Metrology and Inspection Applications

New RFID Antennas Over IO-Link for Numerous Applications

New RFID Antennas Over IO-Link for Numerous Applications

Researchers Develop Cuttable, Flexible Wireless Charger for Smartphones and Smartwatches

Researchers Develop Cuttable, Flexible Wireless Charger for Smartphones and Smartwatches

Stanford Team Builds Wireless, Battery-Free, Biodegradable Blood Flow Sensor

Stanford Team Builds Wireless, Battery-Free, Biodegradable Blood Flow Sensor

TDK Launches Premium Motion Sensor Optimized for Optical and Computational Image Stabilization Applications

TDK Launches Premium Motion Sensor Optimized for Optical and Computational Image Stabilization Applications

TDK MEMS Extends Automotive Motion Sensor Solutions Improving Navigation Through Tunnels, Parking Garages, and High-Temperature Environments

TDK MEMS Extends Automotive Motion Sensor Solutions Improving Navigation Through Tunnels, Parking Garages, and High-Temperature Environments

TDK Announces Coursa Drive, the World’s First High-Precision Inertial-Aided Positioning Software for Autonomous Vehicles

TDK Announces Coursa Drive, the World’s First High-Precision Inertial-Aided Positioning Software for Autonomous Vehicles

TDK Announces New Chirp SonicTrack™ Inside-Out 6-DoF Ultrasonic Controller Tracking Solution for All-In-One VR

TDK Announces New Chirp SonicTrack™ Inside-Out 6-DoF Ultrasonic Controller Tracking Solution for All-In-One VR

Chirp Microsystems and Qualcomm Technologies, Inc. Collaborate to Bring Inside-Out 6-DoF Controller Tracking to Mobile VR/AR Headsets

Chirp Microsystems and Qualcomm Technologies, Inc. Collaborate to Bring Inside-Out 6-DoF Controller Tracking to Mobile VR/AR Headsets

TDK Launches Portfolio of Sensors and Technologies Enabling the Next-Generation of All-In-One VR Platforms

TDK Launches Portfolio of Sensors and Technologies Enabling the Next-Generation of All-In-One VR Platforms

SOS LAB to Introduce New, Improved 3D LiDAR Sensor at CES 2019

SOS LAB to Introduce New, Improved 3D LiDAR Sensor at CES 2019

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