Mar 17 2014
Research and Markets has announced the addition of the "Infineon SP37 Tire Pressure Monitoring Sensor - Technology Analysis" report to their offering.
The latest generation of Infineon's TPMS, the SP37, is a highly integrated TPM sensor which embeds measurement of pressure and radial acceleration (2 DoF) with a low-power microcontroller, a LF receiver and an RF transmitter in a system in package integrating only two dies. This high integration of functions allows to build a complete system with few external components and thus enable system cost savings.
The SP37 inherits its MEMS technology from the acquisition of the Norwegian Sensonor in 2003. Therefore, highly reliable measurements in harsh environments are possible by the use of the mature and low-cost triple stack hermetic wafer bonding technology in combination with buried piezoresistors and conductors.
The SP37 is assembled in a Small Outline 14-pin package and operates under a temperature range of -40 to +125°C.
This report will provide a Physical Analysis & Manufacturing Process Flow.
A full reverse costing analysis report is also available, with a complete teardown of the TPMS.
Key Topics Covered:
PHYSICAL ANALYSIS
Physical Analysis Methodology
Package
- Package Views, Dimensions & Marking
- Package X-Ray
- Package Opening
- Package Cross-Section
ASIC Die
- View, Dimensions & Marking
- Delayering
- Main Blocks
- Cross-Section
- Process Characteristics
MEMS Die
- View, Dimensions & Marking
- Bond Pad Opening & Bond Pad
- Cap Removed
- Sensing Area
- Cross-Section:
- Accelerometer Cross-Section
- Pressure Sensor Cross-Section
MANUFACTURING PROCESS FLOW
- Global Overview
- ASIC Front-End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow & Assembly Unit
For more information visit http://www.researchandmarkets.com/research/vrgc69/infineon_sp37
Source: http://www.researchandmarkets.com/